1. Elimination of common faults of magnetron sputtering source
Fault name: Causes and countermeasures
The discharge is not normal
(1) The abnormal discharge during magnetron sputtering is mainly manifested as overcurrent after the voltage rises to 400V; Or the discharge is not concentrated on the target surface, but extends from the target to the discharge chamber, and it is also accompanied by the discharge phenomenon. The causes and countermeasures are: the sputtering and bombardment conversion contactor fails, so that the sputtering becomes bombardment. The key switch of the sputtering and bombardment converter should be sensitive, and the AC contactor should work normally.
(2) The vacuum degree is too low. It should be appropriately raised. Generally, the vacuum degree should be controlled at (6.67-13.3)x10-'h
Overcurrent
(1) The overcurrent of the new target is mainly due to the residual oxide and dirt on the surface of the target, or the impurity of argon, and the gas component of argon fluctuates. The new target should be sputtered several times to remove dirt and oxide layer; or to improve the purity of argon, adjust the argon pressure and ensure that the pressure reducing valve is working properly. (2) The overcurrent of the stable target is mainly due to the debris on the shield and insulator or the tip discharge and short circuit, or the small air leakage in the inflation system. Short circuits on shields and insulators as well as air leakage in the inflation system should be ruled out. (3) The primer is not fully cured. The curing time of the primer should be extended appropriately
The voltage is too high
(1) The cooling water supply of the target is insufficient. Sufficient cooling water should be passed. Since the magnetron source has to withstand a large amount of power when working, it must be cooled enough to work properly. (2) The temperature of the cooling water is too high or the water is cut off, and the target is heated. The flow rate and pressure of cooling water should be increased appropriately. If the water failure occurs in the working state, the sputtering power supply should be disconnected immediately, and it should be naturally cooled to about 60-80~C before the cooling water can be passed, otherwise, the magnetic ring will burst due to quenching
2. Elimination of common faults of magnetron sputtering film
Fault name: Causes and countermeasures
The film is dull and blackened
(1) The vacuum degree is less than 0.67Pa. The vacuum should be increased to 0.13-0.4Pa.
(2) The purity of argon is less than 99.9%. Argon with a purity of 99.99% should be switched to.
(3) Air leakage in the inflation system. The inflation system should be inspected to rule out air leaks.
(4) The primer is not fully cured. The curing time of the primer should be extended appropriately.
(5) The amount of gassing of the plated parts is too large. Drying and sealing should be carried out
The surface of the film is dull
(1) Poor curing or deterioration of the primer. The curing time of the primer should be extended appropriately or the primer should be replaced.
(2) The sputtering time is too long. It should be appropriately shortened.
(3) The sputtering film formation speed is too fast. The sputtering current or voltage should be appropriately reduced
The color of the film is uneven
(1) The primer is sprayed unevenly. The application method of primer should be improved.
(2) The film layer is too thin. The sputtering speed should be increased appropriately or the sputtering time should be extended.
(3) The fixture design is unreasonable. Fixture design should be improved.
(4) The geometry of the plated parts is too complex. The rotation speed of the plated parts should be increased appropriately
The membrane is wrinkled and cracked
(1) The primer is sprayed too thickly. It should be controlled within the thickness range of 7-lOtan.
(2) The viscosity of the paint is too high. It should be appropriately reduced.
(3) The evaporation rate is too fast. It should be slowed down appropriately.
(4) The film layer is too thick. The sputtering time should be appropriately shortened.
(5) The temperature of the plating parts is too high. The heating time of the plated parts should be appropriately shortened
There are water traces, fingerprints and ash particles on the surface of the film
(1) The plating parts are not fully dried after cleaning. Pre-plating treatment should be strengthened.
(2) The surface of the plating part is splashed with water droplets or saliva. Civilized production should be strengthened, and operators should wear masks.
(3) After applying the primer, the hand touches the plated parts, and the fingerprints are left on the surface. It is strictly forbidden to touch the surface of the plated parts with your hands.
(4) There are particulate matter in the paint. The paint should be filtered or replaced.
(5) Electrostatic precipitator failure or particle dust in the spraying and curing environment. The dust collector should be replaced, and the working environment should be kept clean
Poor adhesion of the film layer
(1) The degreasing and degreasing of the plating parts is not complete. Pre-plating treatment should be strengthened.
(2) The vacuum chamber is not clean. The vacuum chamber should be cleaned. It is worth noting that in the process of target loading and dismantling, it is strictly forbidden to contact the magnetron source with hands or unclean objects to ensure that the magnetron source has a high cleanliness, which is one of the important measures to improve the adhesion of the film layer.
(3) The fixture is not clean. The fixture should be cleaned.
(4) Improper selection of primer. The paint should be replaced.
(5) Improper control of sputtering process conditions. Sputtering process conditions should be improved
